Microvia Reliability Plating Stacking Thermal Stress Testing
Microvia reliability is the cornerstone of High-Density Interconnect (HDI) PCB performance, directly determining product lifespan in aerospace, automotive, and medical devices. This definitive guide covers the three pillars of microvia reliability: copper plating chemistry, via stacking architecture, and thermal stress testing. 1. The Foundation – The Metallurgy of Microvia Plating The reliability of a microvia…